- Bake and Dry Pack
- Bond Pull
- Constant Acceleration
- Coplanarity Inspection
- Counterfeit Detection
- Device Programming
- Die Shear Testing
- External Visual Inspection
- Failure Analysis
- Fluorescent Dye Penetrant
- Heated Chemical Testing
- Hermeticity and Fine/Gross Leakage
- JAN/JANTX/JANS Screening
- PIND Test
- Solder Dip
- Solvents Testing
- Tape and Reel
- Temperature Cycle
- X-Ray Fluorescence
How do I know which test services to use?
No single method of inspection can guarantee the functionality or authenticity of non-OEM traceable units. To ensure the highest possible degree of confidence devices should undergo multiple levels of analysis. Electrical testing can confirm whether or not a device is functional, while procedures like marking permanency and die identification aid in certifying the conformance to manufacturer standards.
Together, the findings of each process performed work as a map to determine the level of reliability of the devices. When positive results are seen across multiple procedures or services, a confident determination in the quality and reliability of the material can be made. Read more about our services below to see which processes apply to your current needs.
Bake and Dry Pack
This service includes the best shipping practices for moisture sensitive parts. The units are baked in a low heat oven for the specified amount of time based on the moisture sensitive level (MSL) according to JEDEC standard 033B. After the parts are baked they are sealed in moisture sensitive and electrostatic discharge safe dry-packing (ESD safe) to ensure their longevity and maintain their MSL level.
Bond Pull Testing
This testing process is a mechanical test process that evaluates the bond quality of the wire bonds within the component. It can be used to verify the bond consistency and reliability throughout the lot. We perform this process via the wire-pull process. This process includes the bond wires being manipulated upward, perpendicular to the substrate until the wire breaks and/or bond failure occurs, verifying that the applied force necessary is beyond the required standards. This process is performed in accordance with MIL-STD-883, Method 2011.
Burn-in is a processing method for detecting early or premature failures in a population of components. A combination of electrical and heat stimuli are applied to the units to replicate long term usage of the components. This process stress-tests the components and is used in conjunction with electrical testing to help to detect failures within the lot. This process is performed in accordance with MIL-STD-883, Method 2015.
This process is a high-stress centrifugal test that simulates the effects of constant acceleration on integrated circuit components (IC components). This is a mechanical process that can determine structural weaknesses in the package types that may not be detected through vibration or shock testing. This process is performed in accordance with MIL-STD-883, Method 2001.
The purpose of this test is to measure the deviation of the terminals (leads or solder balls) from coplanarity at room temperature for surface-mount semiconductor devices. When a package with more than three leads is placed on a flat surface, only the lowest three may be in contact with the surface. If the leads are distorted, a number of them may end up above the surface. This deviation from flatness is referred to as ‘non-coplanarity’, and the plane of the surface on which the package would naturally sit is called the ‘seating plane’. This test is performed to confirm the device leads will line up and sit correctly in their final application.
Counterfeit detection testing is best achieved with a test plan of multiple processes, structured around the specific device and with thought given to the end usage of the component. No singular process can guarantee the functionality and legitimacy of non-OEM traceable units. To ensure the highest possible degree of confidence, devices should be tested using multiple cohesive processes. Each test process will yield conclusive or inconclusive results that, when used together, work as a map to determine the level of confidence in the lot. When all processes are performed with positive conclusive results, you can be highly confident the devices are both authentic and functional.
CSAM (Confocal Scanning Acoustic Microscope)
The CSAM test is a nondestructive check for device delamination. This test uses ultrasound waves to detect changes in acoustic impedances in integrated circuits (IC) and other similar materials. Pulses of different frequencies are used to penetrate various materials to examine sample interiors for voids or delamination. CSAM can be used to detect die surface delamination or metallization burnout. It can also be used to evaluate die attach integrity, heat spreader adhesion, or solder bump quality. This test can be used as a failure analysis tool to identify root causes of a failure, or to evaluate internal die structure integrity of questionable material.
Decapsulation is a process that removes a portion of the device body either chemically or mechanically and inspects the interior die. Die markings, including manufacturer and part numbers, are inspected and verified along with die position, size and orientation. This process is beneficial to determine any evidence of remarking, and can be a useful tool in counterfeit recognition. However, this process does not test the functionality of the device, and can also be inconclusive if no information is found on the die. This process is performed in accordance with MIL-STD-883, Method 2003.
GD4 has the capability to program a variety of devices. We ask that the customer provide us with the parts and program. The program is then loaded and programmed to all of the devices. We can also evaluate a unit for previous programming, which is particularly useful with One-Time Programmable (OTP) devices.
Die Shear Testing
This process measures the strength of the die bond to the component base. It can be used to verify the die bond consistency and reliability throughout the lot. This process is performed in accordance with MIL-STD-883, Method 2019.
Electrical Testing is done to verify that the electrical components meet the manufacturer’s criteria. Every component has a multitude of manufacturer defined functional parameters and limits. We test the components to these parameters/limits to ensure manufacturer specifications are met. By doing this, we can determine if a part matches the manufacturer’s specifications. This process is performed in accordance with MIL-STD-883.
External Visual Inspection
Visual inspections are performed on all incoming material following IDEA 1010 and appropriate MIL-STD-883 standards. Cross referencing the original manufacturer’s datasheet specifications, our lab technicians examine external packaging for signs of: damage, extra marking, remarking, blacktopping and reuse. The leads are also examined for signs of: re-working, prior use, damage, bends and breaks. The lab technician will verify quantity, identify date codes and create a digital photographic record. This process is performed in accordance with MIL-STD-883, Method 2009.
When parts are failing in their end applications, there can be many reasons. We can work with the end user engineers to create the same operating conditions and determine where failure is occurring. Electrical testing can be used to determine the specific failing parameter. Then a variety of other processes such as CSAM, hermetic seal testing, x-ray, decapsulation and more can be used to determine what the root cause of failure may be. This is a wholly customizable process, and can be tailored to the customer’s and device’s specific needs.
Fluorescent Dye Penetrant
This is an inspection process in which fluorescent dye is applied to the surface of the component. This is most effective for metal components with non-porous surfaces. The dye will seep inside any cracks or flaws in the surface of the components and a final inspection will examine the units for flaws. This process is performed in accordance with MIL-STD-883, Method 1034.
Heated Chemical Testing
This process removes the markings and top layer of the component to evaluate for signs of remarking. This can include: prior markings, sanding, pitting, differing body material, or other evidence of tampering. A submersion test utilizing 1-Methyl 2-Pyrrolidinone, followed by Dynasolve removes the part markings and the top layer of the device. This process is very useful for counterfeit detection and is performed in accordance with MIL-STD-883, Method 2015.
Hermeticity and Fine/Gross Leakage
Hermeticity testing examines the effectiveness of the seal of the component package. Fine and gross leakage testing processes can be used to test hermeticity. A damaged seal allows for the free movement of moisture and gases to and from the package cavity through voids in the seal. This can result in internal corrosion and parametric shifts due to moisture effects. It is therefore necessary to detect these failures so that affected materials may be properly quarantined and the root cause of the problem properly addressed. This process is performed in accordance with MIL-STD-883, Method 1014.
JAN, JANTX, and JANTXV diodes are specially designed for joint army and navy applications. This specification establishes the general performance requirements for semiconductor devices. Detail requirements and characteristics are specified in the specification sheet. GD4 can screen diodes of lower or unknown ratings to specific JAN/JANTX/JANS requirements. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection (CI) completion date. Five quality levels for encapsulated devices are provided in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS.
Class JAN: Military level QCI Only
Class JANTX: Screening and QCI without Visual inspection
Class JANS: Highest Space level product
A PIND test is a Particle Impact Noise Detection test. According to method 2020.9 of MIL-STD-883 and method 2052.5 of MIL-STD-750, the purpose of a PIND test is to detect loose particles inside an electronics device cavity. The test provides a nondestructive means of identifying those devices containing particles of sufficient mass that, upon impact within the cavity, excite the transducer.
Dip soldering is accomplished by submerging device leads into a molten solder bath. Thus, all components surfaces are coated with filler metal. GD4 is also able to change the lead finish, i.e., from lead-free to leaded, or from leaded to lead-free. This method is used to improve/restore the solderability of the parts, and can act as the primary finish for the terminations. It is also currently one of the strategies being used to mitigate tin whiskers, which can form when pure tin plating is used.
The solderability of a surface, or device leads/balls is defined by its solder wetting characteristics. Solder wetting pertains to the formation of a relatively uniform, smooth, and unbroken film of solder that exhibits excellent adherence on the soldered surface. This test process consists of first aging the samples in a steam aging machine, re-applying a layer of solder and examining the terminations to ensure a minimum of 95% coverage. This process is performed in accordance with MIL-STD-883, Method 2003.
Resistance to solvents marking permanency testing is performed as part of quality control inspections. The top side of units are subjected to multiple chemicals and temperatures and evaluated for part marking or body deviations and evidence of potential remarking. This process uses a variety of solvents and is performed per MIL-STD-883, Method 2015A.
Tape and Reel
For materials received on tape and reel, we have re-reeling capabilities available in-house. Units can be re-reeled into their original carrier tape, or taped into new media as required.
Temp cycle testing is a stress testing process that exposes the devices to extreme hot and cold temperature thresholds at an accelerated rate. When performed in conjunction with electrical and visual testing, it can help to find failures and determine the quality and longevity of the lot. This process is performed in accordance with MIL-STD- 883, Method 1010.
Many devices have multiple potential ratings, whether it be temperature (Commercial, Industrial, Space, etc.) or rated speed. Due to availability constraints, users may procure material at a lower rating and have it tested at the more demanding rating their end application requires (for example, utilizing Commercial rated parts where the typical requirement may be Industrial rated parts).
X-ray is a relatively inexpensive and non-destructive process with minimal set-up and immediate feedback on the interior structure of a device. It allows the operator to view the internal die orientation, bond wire patterns, and any foreign material or voids. It can also help to detect any abnormalities without being destructive to the units. Uniformity of internal structures is further evaluated among material within the same lot/batch. This process is performed in accordance with MIL-STD- 883, Method 2012.
XRF testing provides an analysis of the elemental composition of the leads; with the capacity to analyze the composition of the components and devices, as well as PCB (printed circuit board) and component assemblies. This analysis includes RoHS (Restriction of Hazardous Substances) verification and/or complete elemental breakdown. Our XRF testing process and equipment have the capability to identify the detailed metal composition of complete components and assemblies, as well as, spot analysis on specific regions of the components. This process is also used to validate parts for RoHS screening to determine the presence of hazardous heavy metals (such as lead, mercury, hexavalent chromium and cadmium). This process can be necessary when parts must be verified to a specific environmental standard.